Basic Info.
Model NO.
FD-460LX-3Q
Processing Object
Flat Workpieces
Abrasives
Grinding Wheel
Controlling Mode
PLC
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Application
Grinding Industry
Material
Metal and Non-Metal
Disc Diameter
Φ910 mm
Service
Oversea Setup & After-Sale Avalaible
Class
Single Plate
Process Station
3
Pressure Source
Pneumatic or Weight Block
Plate Material
Metal & Non-Metal
Abrasive
Slurry
Weight
1000kg
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year
Product Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Main uses:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, silicon wafers, sheets, molds, light guide plate, light plate joint valve, hydraulic tight, stainless steel, and other materials of single-side grinding, polishing.
Products Show
High precision grinding machine features:
1. Using interval type automatic spray device, can be freely set the spray interval time.
2. Series grinding machine workpiece pressure using pressure block pressure, cylinder lifting way; After polishing, the workpiece surface brightness is high, no scratch, no material grain, no pitting, no collapsing edge, high flatness. After polishing the workpiece surface roughness can reach Ra0.0002; Flatness can be controlled within the range of ±0.002mm.
3. The cylinder has the function of preventing air loss to ensure personal and equipment safety.
4. Series grinding machine adopts switch press control system, grinding disk speed and timing can be directly set on the control panel.
5. The equipment is equipped with three work stations (including three sets of weight pressing and self-locking systems), which can simultaneously carry out polishing and grinding processing of three groups of products.
APPLICATION
SPECIFICATION
SAMPLE DEMONSTRATION (SINGLE PLATE)
About the Company 
Factory front desk
Production and assembly shop
Patent
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Main uses:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, silicon wafers, sheets, molds, light guide plate, light plate joint valve, hydraulic tight, stainless steel, and other materials of single-side grinding, polishing.
Products Show
High precision grinding machine features: 1. Using interval type automatic spray device, can be freely set the spray interval time.
2. Series grinding machine workpiece pressure using pressure block pressure, cylinder lifting way; After polishing, the workpiece surface brightness is high, no scratch, no material grain, no pitting, no collapsing edge, high flatness. After polishing the workpiece surface roughness can reach Ra0.0002; Flatness can be controlled within the range of ±0.002mm.
3. The cylinder has the function of preventing air loss to ensure personal and equipment safety.
4. Series grinding machine adopts switch press control system, grinding disk speed and timing can be directly set on the control panel.
5. The equipment is equipped with three work stations (including three sets of weight pressing and self-locking systems), which can simultaneously carry out polishing and grinding processing of three groups of products.
APPLICATION
| Single Plate Lapping & Polishing | Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone | Sealing | valve and sealing ring(liquid, oil, gas) |
| Semiconductor | LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) | ||
| Plastic | PE, E/VAC, SBS, SBR, NBR, SR, BR, PR | ||
| Phone Frame(flat) | back plate | ||
| PCB | adhesive, coating, circuit | ||
| Optics(flat) | optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass | ||
| Radar | oxide coating plate | ||
| Gemstone | jade, sapphire, agate, etc. | ||
| Others | graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. | ||
| *NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed. | |||
SPECIFICATION
| Standard Specification | |||||||
| Machine Model | FD3803 | FD4603 | FD6103 | FD9104 | |||
| Plate Diameter | Φ380 mm / 15 inches | Φ460mm / 18 inches | Φ610mm / 24 inches | Φ910mm / 36 inches | |||
| Max. Workpiece Diameter (without conditioning ring) | Φ180 mm | Φ220 mm | Φ270 mm | Φ420 mm | |||
| Conditioning Ring Diameter | Φ180 mm | Φ220 mm | Φ270 mm | Φ420 mm | |||
| Number of Station | 3 | 3 | 3 | 4 | |||
| Plate Rotate Speed | 0-140 rpm | 0-140 rpm | 0-120 rpm | 0-90 rpm | |||
| Facing & Grooving Speed (Not include in Polishing) | 0-120 mm/m | 0-120 mm/m | 0-120 mm/m | 0-120 mm/m | |||
| Total Weight | 450 kg | 780 kg | 1000 kg | 1600 kg | |||
| Total Floor Space | 670×940 mm | 1030×730 mm | 1920×840 mm | 2100×1300 mm | |||
| Built-In Optional Kits | |||||||
| Grade | Standard | Upgraded | Advanced | ||||
| Controls | Digital | Digital | Touch-Screen PLC | ||||
| Pressure Source | Hand Weight Block | Pneumatic Weight Block Manual | Pneumatic Press Integrated with PLC | ||||
| Slurry Supply System | - | Manual | Digital, Manual | ||||
| Cylinder Bar Drive System | - | Manual | Integrated with PLC | ||||
| Conditioning Ring Drive System | - | Manual | Integrated with PLC | ||||
| Machine Enclosure | - | Framed by Aluminum Alloy | Framed by Metal Plate | ||||
| *NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. | |||||||
SAMPLE DEMONSTRATION (SINGLE PLATE)
About the Company
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
45 people
Patent
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.